Embedded Single Board Computer


Embedded Single Board Computer
The MBE70 Series of motherboard integrated various useful peripheral circuit that provides completed connectivity for a wide variety of industrial automation, transportation applications, besides that the high-performance media-processor also especially for Infotainment/ Entertainment, HMI applications.
The heart of the motherboard MBE70 is the Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz processor which provides a complete platform for project evaluation and solution feasibility testing that decreases the time to market and lowers initial cost.
Product Features
 A small 126.5mm x 90mm compact design
 RK3399 Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz
 Support OS Android 7.1/8.0, Linux Debian 9.0
 PoE (PD): follows IEEE 802.3 at
Processor Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz
Multi-Media Processor
  • ARM Mail-T860MP4 (GPU), AFBC supported
  • Provides OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11
  • Video Decoder: H.264/H.265, 10bit, up to 4Kx2K@60fps, VP9, 8bit, up to 4Kx2K@60fps, MPEG-4/MPEG-2/VP8 up to 1080p@60fps
  • Video Encoder: H.264/MVC/VP8 encoders by 1080p@30fps
Memory 2GB DDR3-1066 SDRAM (Up to 4GB)
  • 8GB eMMC ( Up to 16 GB)
  • Micro SD Card Slot (Max. 1 TB available)
  • Android 7.1/8.0
  • Linux (Debian 9.0)
Display Interface
  • eDP: 1.3, 2 lane (2.7Gbps per lane) , Res. up to 1920x1200p @60fps
  • eDP: 1.3, 4 lane (2.7Gbps per lane) , Res. up to 2560x1600p @60fps (Optional)
  • LVDS: with eDP-2-LVDS board
External I/O
  • 1 x Power Jack
  • 1 x Micro SD/SDHC Card Slot
  • 1 x USB 3.0 Type-A
  • 1 x USB 2.0 Type-A
  • 1 x HDMI® V2.0 Type-A
  • 1 x Gigabit Ethernet
Internal I/O
  • eDP 1.3, 2 lane , 1080p@60fps, ZIF
  • 1 x RTC Battery Backup Connector, Wafer
  • LCD Backlight control wafer
  • PCAP touch panel wafer
  • mPCIe Slot with PCIe and USB Signal
  • USB 2.0 (x 3) expansion header
  • Audio Combo Header, (Mic_in, Line_out, Spk_out, HP_out, SPDIF)
  • Keys, DIDO extension header
  • MIPI-CSI, ZIF connector (option)
  • MEMS Combo header (option)
  • RS232 console wafer
Operating Temperature
  • Commercial: 0°C ~ 70°C (MBE70C)
  • Commercial Extension: -20°C ~ 70°C ( MBE70E)
Operating Humidity 10% to 90% (non-condensing)
Cooling System Fan-less design
Dimension ( L x W) 126.5mm x 90mm
Power Input 12V
PoE (Optional) Supports Power Device(PD): follows IEEE 802.3at ( 25W)
MBE71 User Manual 下載
MBE71 Flyer 下載

Feature Products