Embedded System & Platform

MBE60

Embedded System & Platform
[{"value":"1.0GHz NXP i.MX6 Quad\/ Dual Lite Cortex-A9 SoC"},{"value":"2GB DDR3-1066 SDRAM onboard (Optional 4GB)"},{"value":"8GB of eMMC memory ( Optional16 GB)"},{"value":"Android 6.0, Linux 4.1.15, Yocto Project2.0 with QT 5.5 (Weston Wayland UI)"},{"value":"Power Over Ethernet ( Optional)"}]
Product Features
Specification
Processor 1.0GHz NXP i.MX6 Quad/ Dual/ Dual Lite Cortex-A9 SoC
Memory 2GB DDR3-1066 SDRAM onboard (Optional 4GB)
Storage 8GB of eMMC memory (Optional 16GB)
OS Android 6.0, Linux 4.1.15, Yocto Project2.0 with QT 5.4 (Weston Wayland UI)
Interface LVDS, HDMI
Ethernet 1 x RJ45-10/100/1000 Mbps
HDMI 1 x HDMI® 1.4 port
COM Port 1 x COM1 (supports 5-wire TX/RX/RTS/CTS) RS232 DTE mode/RS485/RS422
USB Port 1 x USB 3.0(OTG) Type B & 1 x USB 2.0 Type A
LED 1 x Power LED & WIFI LED (if Wi-Fi has installed)
SD Slot 1 x Micro SD/SDHC card slot
Boot Select Switch 1 x Micro SD/eMMC boot select switch
Reset 1 x Reset Button
Power Jack 1 x Power Jack
PoE Supports PoE (Optional), Power Device(PD): follows IEEE 802.3af (12.5W)
WIFI / BT Wi-Fi module (Optional)
Audio Audio Audio Combo Header, (Mic_in,Line_out, Spk_out, HP_out, SPDIF)
MIPI-CSI MIPI-CSI, ZIF connector
Backlight Control LCD Backlight control wafer
PCAP PCAP touch panel wafer
USB 1 x USB 2.0 expansion header
Interface multi-role, keypad, GPIOs
UART 1 x UART2 wafer
Operating Temperature Commercial version: 0℃ to 60℃, Industrial version :-20℃ to 60℃
Operating Humidity 10% to 90% (non-condensing)
Cooling System Fanless design
Dimension ( L x W) 110mm x 70mm
Power Input 12V
Power Over Ethernet Supports PoE (Optional), Power Device(PD): follows IEEE 802.3af ( 12.5W)
Downloads

Feature Products