Processor |
Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz |
Multi-Media Processor |
- ARM Mail-T860MP4 (GPU), AFBC supported
- Provides OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11
- Video Decoder: H.264/H.265, 10bit, up to 4Kx2K@60fps, VP9, 8bit, up to 4Kx2K@60fps, MPEG-4/MPEG-2/VP8 up to 1080p@60fps
- Video Encoder: H.264/MVC/VP8 encoders by 1080p@30fps
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Memory |
2GB DDR3-1066 SDRAM (Up to 4GB) |
Storage |
- 8GB eMMC ( Up to 16 GB)
- Micro SD Card Slot (Max. 1 TB available)
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OS |
- Android 7.1/8.0
- Linux (Debian 9.0)
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Display Interface |
- eDP: 1.3, 2 lane (2.7Gbps per lane) , Res. up to 1920x1200p @60fps
- eDP: 1.3, 4 lane (2.7Gbps per lane) , Res. up to 2560x1600p @60fps (Optional)
- LVDS: with eDP-2-LVDS board
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External I/O |
- 1 x Power Jack
- 1 x Micro SD/SDHC Card Slot
- 1 x USB 3.0 Type-A
- 1 x USB 2.0 Type-A
- 1 x HDMI® V2.0 Type-A
- 1 x Gigabit Ethernet
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Internal I/O |
- eDP 1.3, 2 lane , 1080p@60fps, ZIF
- 1 x RTC Battery Backup Connector, Wafer
- LCD Backlight control wafer
- PCAP touch panel wafer
- mPCIe Slot with PCIe and USB Signal
- USB 2.0 (x 3) expansion header
- Audio Combo Header, (Mic_in, Line_out, Spk_out, HP_out, SPDIF)
- Keys, DIDO extension header
- MIPI-CSI, ZIF connector (option)
- MEMS Combo header (option)
- RS232 console wafer
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Operating Temperature |
- Commercial: 0°C ~ 70°C (MBE70C)
- Commercial Extension: -20°C ~ 70°C ( MBE70E)
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Operating Humidity |
10% to 90% (non-condensing) |
Cooling System |
Fan-less design |
Dimension ( L x W) |
126.5mm x 90mm |
Power Input |
12V |
PoE (Optional) |
Supports Power Device(PD): follows IEEE 802.3at ( 25W) |