Embedded System & Platform

MBE70

Embedded System & Platform
The MBE70 Series of motherboard integrated various useful peripheral circuit that provides a completed connectivity for a wide variety of industrial automation, transportation applications, besides that the high performance media-processor also especially for Infotainment/ Entertainment, HMI applications.
The heart of the motherboard MBE70 is the Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz processor which provides complete platform for project evaluation and solution feasibility testing that decreases the time to market and lowers initial cost.
Product Features
 A small 126.5mm x 90mm compact design
 RK3399 Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz
 2GB DDR3-1066 SDRAM/ 8GB eMMC
 GigE x1, 2.4G/ 5G Wi-Fi x1
 eDP: 1.3, 2/4 lane (2.7Gbps per lane) , Res. up to 2560x1600p @60fps
 Support OS Android 7.1, Linux Debian 9.0
 Power Over Ethernet ( Optional)
Specification
Processor Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz
Multi-Media Processor
Memory 2GB DDR3-1066 SDRAM (Up to 4GB)
Storage
  • 8GB eMMC ( Up to 16 GB)
  • Micro SD Card Slot (Max. 1 TB available)
OS
  • Android 7.1
  • Linux(Debian 9.0)
Display Interface
  • eDP: 1.3, 2 lane (2.7Gbps per lane) , Res. up to 1920x1200p @60fps
  • eDP: 1.3, 4 lane (2.7Gbps per lane) , Res. up to 2560x1600p @60fps (Optional)
  • LVDS: with eDP-2-LVDS board
External I/O
  • 1 xPower Jack
  • 1 xMicro SD Socket
  • 1 xUSB 3.0 Type-A Port
  • 1 xUSB 2.0 Type-A Port
  • 1 xHDMI® Port
  • 1 xGigabit Ethernet Port
Internal I/O
  • 1 xImage File Update Jumper
  • 1 xRTC Battery Backup Connector, Wafer
  • 1 xPower Switch & Power Button, Header
  • 1 xPower LED Connector, Wafer
  • 1 xIR Receiver Connector, Wafer
  • 1 xeDP Interface
  • 1 xLCD Panel Power Selection, Header
  • LCD Backlight Control Connector, Wafer
  • 1 xPCAP Touch Interface, Wafer
  • 1 xMulti-Role Interface, Wafer
  • 1 xKeyPAD & GPIOs Combo Interface, Header
  • 1 xRS232 Debug & Buzzer-Out Combo Interface, Header
  • 1 x WLAN and Bluetooth Antenna Connector, MHF-IV Receptacle
  • 1 xHUB Extended Ports, Wafer & Header
  • 1 xAudio Codec Interface, Header
Operating Temperature
  • Commercial: 0°C ~ 70°C( MBE70C)
  • Commercial Extension: -20°C ~ 70°C( MBE70E)
Operating Humidity 10% to 90% (non-condensing)
Cooling System Fanless design
Dimension ( L x W) 126.5mm x 90mm
Power Input 12V
PoE (Optional) Supports Power Device(PD): follows IEEE 802.3at ( 25W)
Downloads
MBE70 V10 User Manual 下載
MBE70 Flyer 下載

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