Embedded System & Platform

MBE60

Embedded System & Platform
The MBE60 Series of motherboard integrated various useful peripheral circuit that provides a completed connectivity for a wide variety of industrial automation, transportation, infotainment, HMI, and energy management applications.

The heart of the motherboard MBE60 is the i.MX6 Quad/Dual or DualLite processor which provides complete platform for project evaluation and solution feasibility testing that decreases the time to market and lowers initial cost.
Product Features
 A small 2.5 inch compact design
 NXP i.MX6 Quad/ Dual Lite Cortex-A9 1.0GHz
 2GB DDR3-1066 SDRAM/ 8GB eMMC
 GigE x1, 2.4G/ 5G Wi-Fi (mPCIe) x1
 LVDS: dual channel-24bit for max. 1080P
 Support OS Android 6.0, Linux 4.1.15 Yocto Project with QT5.5
 SD/ eMMC boot-up selectable
 Power Over Ethernet ( Optional)
Specification
Processor 1.0GHz NXP i.MX6 Quad/ Dual/ Dual Lite Cortex-A9 SoC
Memory 2GB DDR3-1066 SDRAM (Up to 4GB)
Storage 8GB eMMC (Up to 16GB)
OS
  • Android 6.0
  • Linux 4.1.15, Yocto Project2.0 with QT 5.4 (Weston Wayland UI)
Display Interface LVDS: dual channel-24bit for max. 1080P
External I/O
  • 1 x 2-pole Terminal DC jack
  • 1 x Power LED & WLAN/WPAN/WWAN LED (if Wi-Fi has installed)
  • 1 x Micro SD/eMMC boot select switch
  • 1 x COM1 (supports 5-wire TX/RX/RTS/CTS) RS232 DTE mode/RS485/RS422
  • 1 x Gigabit Ethernet port
  • 1 x Reset button
  • 1 x Mini USB 2.0 type B port support OTG
  • 1 x USB 2.0 type A port
  • 1 x Micro SD socket
Internal I/O
  • 1 x LVDS wafer
  • 1 x LCD panel power selection header
  • 1 x LCD Backlight control wafer
  • 1 x PCAP touch panel wafer
  • 1 x miniPCIe Slot
  • 1 x UART2 wafer
  • 1 x UART2 wafer
  • 1 x CAN/Debug header
  • 1 x USB 2.0 expansion header
  • 1 x DIO extension header
  • 1 x Audio in/out Header
  • 1 x External RTC Battery wafer
  • 1 x External Buzzer wafer
Operating Temperature
  • Commercial: 0°C to 70°C (MBE60C)
  • Commercial Extension:-20°C to 70°C (MBE60E)
Operating Humidity 10% to 90% (non-condensing)
Cooling System Fanless design
Dimension ( L x W) 110mm x 70mm
Power Input 12V
PoE (Optional) Supports Power Device(PD): follows IEEE 802.3 af
Downloads
MBE60 V10 User Manual 下載
MBE60 Flyer 下載

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